Electronic component and method of manufacturing electronic component

ABSTRACT

An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. application Ser. No. 15/298,577filed Oct. 20, 2016 and claims benefit of priority to Japanese PatentApplication 2015-237751 filed Dec. 4, 2015, the entire content of whichis incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to an electronic component and a methodof manufacturing an electronic component.

BACKGROUND

Conventional electronic components include an electric componentdescribed in WO 2015/115180A1. This electronic component has a compositebody made of a composite material of a resin material and a metalpowder, and an external electrode disposed on the composite body. Theexternal electrode is formed by electrolytic plating. As a result, theexternal electrode and the metal powder are metal-bonded so that theexternal electrode strongly adheres to the composite body.

SUMMARY Problem to be Solved by the Disclosure

The present inventors conceived not only improving adhesion due to abond between the external electrode and the metal powder but alsoimproving adhesion between the external electrode and the resin materialfor the following reasons.

It has recently been attempted in circuits using electronic componentsto make frequencies of signals higher to improve characteristics andfunctions. It is expected that as higher-frequency signals are dealtwith in the future, a magnetic loss generated in the metal powder of theelectronic component becomes larger. Therefore, to reduce the magneticloss, it is conceived that particles of the metal powder are madesmaller in particle diameter as compared to conventional particles.

Since the metal powder smaller in particle diameter reduces surfaceroughness and increases flatness on a surface of the composite body onwhich the external electrode is disposed, the anchor effect is hardlyproduced, which reduces the adhesion of the external electrode to thecomposite body. Moreover, since the metal powder smaller in particlediameter increases the possibility of the metal powder sheddingparticles from the composite body, a proportion of the metal powderdecreases in a portion of the composite body contacting with theexternal electrode, and a proportion of a resin material accordinglyincreases. Therefore, a proportion of the contact portion between theexternal electrode and the metal powder associated with a strong bondingforce decreases, while a proportion of the contact portion between theexternal electrode and the resin material associated with a weak bondingforce increases, resulting in a reduction in adhesion of the externalelectrode to the composite body.

Therefore, a problem to be solved by the present disclosure is toprovide an electronic component and a method of manufacturing anelectronic component improving the adhesion of the external electrode tothe composite body.

Solutions to the Problems

To solve the problem, the present disclosure provides an electroniccomponent comprising:

a composite body made of a composite material of a resin material and ametal powder; and

a metal film disposed on an outer surface of the composite body, wherein

the metal film is in contact with the resin material and the metalpowder of the composite body, and wherein

an average particle diameter of crystals of the metal film contactingthe resin material is 60% or more and 120% or less of an averageparticle diameter of crystals of the metal film contacting the metalpowder.

According to the electronic component of the present disclosure, themetal film is in contact with the resin material and the metal powder ofthe composite body, and an average particle diameter of crystals of themetal film contacting the resin material is 60% or more and 120% or lessof an average particle diameter of crystals of the metal film contactingthe metal powder. A state of the metal film having a small difference inaverage particle diameter of crystals between on the metal powder and onthe resin material corresponds to a state in which the metal film with acomparatively small particle diameter has been able to be formed on theresin material. Therefore, the anchor effect is easily produced betweenthe metal film and the resin material so that the adhesion between theresin material and the metal film can be improved. Thus, the adhesion onthe resin material can be ensured to improve the adhesion of the entiremetal film.

In an embodiment of the electronic component, the outer surface of thecomposite body has a recess such that the inside of the recess is filledwith the metal film.

According to the embodiment, since the inside of the recess is filledwith the metal film, the adhesion between the metal film and thecomposite body can further be improved.

In an embodiment of the electronic component, a portion of the filmthickness of the metal film on the metal powder is equal to or less thanthe film thickness of the metal film on the resin material.

According to the embodiment, since a portion of the film thickness ofthe metal film on the metal powder is equal to or less than the filmthickness of the metal film on the resin material, the unevenness in theelectronic component can be reduced. Particularly when the metal filmserves as external electrodes, the mounting stability and thereliability are improved and, if the metal film serves as internalelectrodes, the stability at the time of lamination is improved.

In an embodiment of the electronic component, the electronic componentcomprises an internal electrode embedded in the composite body, and themetal film is in contact with the internal electrode.

According to the embodiment, since the metal film is in contact with theinternal electrode, the metal film and the internal electrode aresterically disposed and, therefore, internal members can be disposedwithout being affected by a disposition area of the metal film.

In an embodiment of the electronic component, the metal film and theinternal electrode are made of the same material.

According to the embodiment, since the metal film and the internalelectrode are made of the same material, the adhesion between the metalfilm and the internal electrode is improved.

In an embodiment of the electronic component, the outer surface of thecomposite body has a principal surface, and the metal powder is exposedfrom the resin material at the principal surface and the metal film isdisposed thereon.

According to the embodiment, since the metal powder is exposed from theresin material at the principal surface of the composite body and themetal film is disposed thereon, when the metal film is formed on theprincipal surface of the composite body, the exposed metal powder can beused and the manufacturing efficiency is improved.

In an embodiment of the electronic component, a shape of the metalpowder exposed from the resin material includes a shape acquired bycutting a portion of an ellipsoid.

According to the embodiment, since a shape of the metal powder exposedfrom the resin material includes a shape acquired by cutting a portionof an ellipsoid, the metal film formed on this metal powder can beimproved in the adhesion to the composite body.

In an embodiment of the electronic component, a resin film is disposedon a portion of the principal surface without the metal film disposedthereon, and the resin film covers the metal powder exposed from theresin material.

According to the embodiment, since a resin film is disposed on a portionof the principal surface without the metal film disposed thereon and theresin film covers the metal powder exposed from the resin material, theexposure of the metal powder to the outside can be prevented.

In an embodiment of the electronic component, the metal film ispartially disposed on the resin film.

According to the embodiment, since the metal film is partially disposedon the resin film, the resin film can be substituted for a mask at thetime of pattern formation of the metal film, and the manufacturingefficiency of the metal film formation is improved.

In an embodiment of the electronic component, the metal powder is madeof metal or alloy containing Fe, and the metal film is made of metal oralloy containing Cu.

According to the embodiment, since the metal powder is made of metal oralloy containing Fe and the metal film is made of metal or alloycontaining Cu, the metal film can be formed by electroless platingwithout using a catalyst. Since the metal powder is made of metal oralloy containing Fe, the magnetic permeability can be improved and,since the metal film is made of metal or alloy containing Cu, theconductivity can be improved.

In an embodiment of the electronic component, the film thickness of themetal film on the metal powder is 60% or more and 160% or less of thefilm thickness of the metal film on the resin material.

According to the embodiment, since the film thickness of the metal filmon the metal powder is 60% or more and 160% or less of the filmthickness of the metal film on the resin material, the film thickness ofthe metal film becomes uniform. Therefore, the unevenness in theelectronic component can be reduced. Particularly, when the metal filmserves as external electrodes, the mounting stability and thereliability are improved and, when the metal film serves as internalelectrodes, the stability at the time of lamination is improved.

In an embodiment of the electronic component, Pd does not exist in theinterface between the metal powder and the metal film as well as theinterface between the resin material and the metal film.

According to the embodiment, Pd does not exist in the interface betweenthe metal powder and the metal film as well as the interface between theresin material and the metal film. The metal film is formed withoutapplying a catalyst, and the manufacturing efficiency of the metal filmformation is improved.

In an embodiment of the electronic component, Pd does not exist in theinterface between the resin material and the metal film, and Pd existsin the interface between the metal powder and the metal film.

According to the embodiment, while Pd does not exist in the interfacebetween the resin material and the metal film, Pd exists in theinterface between the metal powder and the metal film, and therefore,the metal film can be formed by electroless plating by using thecatalyst Pd. In particular, even if the metal film is baser than themetal powder, a displacement Pd catalyst treatment can be performed toform the metal film. Therefore, a degree of freedom is improved in termsof material selection for the metal powder and the metal film.

In an embodiment of the electronic component, a portion of the metalfilm goes around along the outer surface of the metal powder to theinner side of the composite body.

According to the embodiment, since a portion of the metal film goesaround along the outer surface of the metal powder to the inner side ofthe composite body, an increase in area of contact with the metal powderimproves the bonding force with the metal powder, and the contact withthe composite body along the shape of the gap between the resin materialand the metal powder improves the anchor effect with the composite body.

In an embodiment of the electronic component, a crystal particlediameter of the metal film is made larger from the side contacting withthe composite body toward the opposite side thereof.

According to the embodiment, since a crystal particle diameter of themetal film is made larger from the side contacting with the compositebody toward the opposite side thereof, the metal film has a relativelysmall crystal particle diameter on the side contacting with thecomposite body and, therefore, the metal film easily produces the anchoreffect with the resin material, so that the adhesion between the metalfilm and the composite body can be improved.

An embodiment of a method of manufacturing an electronic componentcomprises

a grinding step of grinding a portion of a composite body made of acomposite material of a resin material and a metal powder to expose themetal powder from a ground surface of the composite body; and

a metal film formation step of forming a metal film on the groundsurface of the composite body by using electroless plating.

According to the embodiment, a portion of the composite body is groundto expose the metal powder from a ground surface of the composite bodyand a metal film is formed on the ground surface of the composite bodyby using electroless plating. As a result, the adhesion between themetal film and the composite body and the film strength and conductivityof the metal film itself can be improved. Additionally, a desiredthickness can be acquired with reduced variations, and the metal filmcan be formed by a simple method with a high manufacturing efficiency.

In an embodiment of the method of manufacturing an electronic component,at the metal film formation step, the metal film is formed on the resinmaterial and the metal powder by using the electroless plating.

According to the embodiment, at the metal film formation step, the metalfilm is formed on the resin material and the metal powder by using theelectroless plating and, therefore, the bonding force between the metalfilm and the metal powder is improved and, even when unevenness on theresin material is slight, the metal film can be formed along theunevenness and the adhesion between the metal film and the resinmaterial can be ensured.

In an embodiment of the method of manufacturing an electronic component,at the metal film formation step, the metal film is formed by using adisplacement precipitation reaction to precipitate the metal film on themetal powder exposed from the ground surface and by growing theprecipitated metal film by using the electroless plating.

According to the embodiment, at the metal film formation step, the metalfilm is formed by using a displacement precipitation reaction toprecipitate the metal film on the metal powder exposed from the groundsurface and by growing the precipitated metal film by using theelectroless plating and, therefore, the metal film can be formed in asimple process.

In an embodiment of the method of manufacturing an electronic component,at the metal film formation step, the electroless plating is performedwithout applying a catalyst.

According to the embodiment, at the metal film formation step, theelectroless plating is performed without applying a catalyst and,therefore, the metal film can be formed in a simple process.

In an embodiment of the method of manufacturing an electronic component,the metal powder is made of metal or alloy containing Fe, and the metalfilm is made of metal or alloy containing Cu.

According to the embodiment, since the metal powder is made of metal oralloy containing Fe and the metal film is made of metal or alloycontaining Cu, the metal film can be formed by the electroless platingwithout using a catalyst. Since the metal powder is made of metal oralloy containing Fe, the magnetic permeability can be improved and,since the metal film is made of metal or alloy containing Cu, theconductivity can be improved.

An embodiment of the method of manufacturing an electronic componentcomprises

a resin film formation step of forming a resin film on a region of aportion of the ground surface of the composite body after the grindingstep, and

the resin film is used as a mask to form the metal film at the metalfilm formation step.

According to the embodiment, since a resin film is formed on a region ofa portion of the ground surface of the composite body after the grindingstep and the resin film is used as a mask to form the metal film, thepattern formation can be achieved without etching the metal film and themanufacturing efficiency is improved.

Effect of the Disclosure

According to the electronic component and the method of manufacturing anelectronic component of the present disclosure, the adhesion of themetal film to the composite body is improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an embodiment of an electroniccomponent of the present disclosure.

FIG. 2 is an enlarged view of a portion A of FIG. 1.

FIG. 3 is a cross-sectional image of an interface between a metal filmformed by using electroless plating and a composite body, correspondingto FIG. 2.

DETAILED DESCRIPTION

The present disclosure will now be described in detail with reference toshown embodiments.

FIG. 1 is a cross-sectional view of an embodiment of an electroniccomponent of the present disclosure. As shown in FIG. 1, the electroniccomponent 1 represents a coil component. The electronic component 1 hasa substrate 10, first and second coil conductors 21, 22 disposed onupper and lower surfaces of the board 10, an insulator 30 covering theboard 10 and the first and second coil conductors 21, 22, a compositebody 40 covering the insulator 30, and first and second externalelectrode 51, 52 disposed in an upper surface of the composite body 40.

The board 10 is a printed-wiring board made of glass cloth impregnatedwith an epoxy resin. The board 10 may be made of an insulating resinsuch as benzocyclobutene or an insulating inorganic material such asglass ceramics. The thickness of the board 10 is about 80 μm, forexample. In this application, the term “thickness” means a thicknessalong a thickness direction of the board 10 (an up-down direction on theplane of FIG. 1).

The first and second coil conductors 21, 22 are made of a conductivematerial such as Au, Ag, Cu, Pd, and Ni. The first coil conductor 21 isdisposed on the lower surface of the board 10. The first coil conductor21 is formed into a spiral shape swirling clockwise and away from thecenter when viewed from above, for example. The second coil conductor 22is disposed on the upper surface of the board 10. The second coilconductor 22 is formed into a spiral shape swirling counterclockwise andaway from the center when viewed from above, for example. The first andsecond coil conductors 21, 22 have a thickness of 40 μm or more and 120μm or less, for example.

The first coil conductor 21 has an outer circumferential end connectedto an extraction electrode 25 a disposed on the lower surface of theboard 10. The extraction electrode 25 a is connected to a through-holeelectrode 25 b penetrating the board 10. The through-hole electrode 25 bis connected to an extraction electrode 25 c disposed on the board 10.The extraction electrode 25 c is connected to an internal electrode 26 aembedded in the composite body 40. The internal electrode 26 a isconnected to the first external electrode 51.

The second coil conductor 22 has an outer circumferential end connectedto an extraction electrode 25 d disposed on the upper surface of theboard 10. The extraction electrode 25 d is connected to an internalelectrode 26 b embedded in the composite body 40. The internal electrode26 a is connected to the second external electrode 52.

The first coil conductor 21 has an inner circumferential end connectedthrough a via-hole electrode (not shown) penetrating the board 10, to aninner circumferential end of the second coil conductor 22. As a result,a signal input from the first external electrode 51 goes sequentiallythrough the first coil conductor 21 and the second coil conductor 22 andis output from the second external electrode 52.

The insulator 30 is made of an epoxy resin etc. The insulator 30 may bemade of an insulating resin such as benzocyclobutene or an insulatinginorganic material such as glass ceramics. The thickness of theinsulator 30 may be a thickness capable of covering the first and secondcoil conductors 21, 22 and is, for example, 45 μm or more and 150 μm orless.

The composite body 40 is made of a composite material of a resinmaterial 41 and a metal powder 42. The resin material 41 may be, forexample, an organic material such as a polyimide resin and an epoxyresin. The metal powder 42 may be, for example, powder made of a metalmaterial such as Fe, Si, Cr, and Ni or made of an alloy materialcontaining these metal materials. The metal powder 42 may be powder madeof multiple types of materials. The average particle diameter of themetal powder 42 is, for example, 0.1 μm or more and 5 μm or less, andthe metal powder 42 having such a small particle diameter prominentlyproduces the effect of the configuration of the electronic component 1,as described later. The average particle diameter of the metal powder 42is calculated as is the case with an average particle diameter ofcrystals of the metal film described later. During manufacturingprocesses of the electronic component 1, the average particle diameterof the metal powder 42 can be calculated as a particle diametercorresponding to 50% of an integrated value in particle sizedistribution obtained by a laser diffraction/scattering method.

The composite body 40 has an inner magnetic path 40 a and an outermagnetic path 40 b. The inner magnetic path 40 a is located in the innerdiameters of the first and second coil conductors 21, 22. The outermagnetic path 40 b is located above and below the first and second coilconductors 21, 22. The thickness of the outer magnetic path 40 b is, forexample, 10 μm or more and 50 μm or less.

The first and second external electrodes 51, 52 are formed of a metalfilm disposed on a principal surface 45 on the exterior of the compositebody 40 and a film formed by using electroless plating. The metal filmmay be, for example, a film made of a metal material such as Au, Ag, Pd,Ni, and Cu, an alloy material thereof, or a material acquired byallowing these materials to contain P or B. The film thickness of themetal film is, for example, 5 μm and is preferably 1 μm or more and 10μm or less. The first and second external electrodes 51, 52 may have alaminated configuration in which a surface of the metal film is furthercovered with another plating film. In the following description, it isassumed that the first and second external electrodes 51, 52 are asingle layer of the metal film.

FIG. 2 is an enlarged view of a portion A of FIG. 1. As shown in FIGS. 1and 2, the principal surface 45 on the exterior of the composite body 40is a ground surface formed by grinding. On the principal surface 45, themetal powder 42 is exposed from the resin material 41. It is assumedthat this exposure includes not only the exposure to the outside of theelectronic component 1 but also the exposure to another member, i.e.,the exposure at a boundary surface to another member.

The metal film (the first and second external electrode 51, 52) is incontact with the resin material 41 and the metal powder 42 of thecomposite body 40. The average particle diameter of crystals of themetal film contacting the resin material 41 (a portion B of FIG. 2) is60% or more and 120% or less of the average particle diameter ofcrystals of the metal film contacting the metal powder 42 (a portion Cof FIG. 2). A state of the metal film having a small difference inaverage particle diameter of crystals between on the metal powder 42 andon the resin material 41 as described above corresponds to a state inwhich a metal film with a comparatively small particle diameter has beenable to be formed on the resin material 41.

Specifically, in general, a metal film formed on the composite body 40by plating starts precipitating on the metal powder 42 and graduallyprecipitates around the metal powder 42 including on the resin material41. As described later, the average particle diameter of crystals of themetal film formed by plating becomes larger in a region of laterprecipitation than a region of earlier precipitation. Therefore, as inthe metal film described above, when a difference in average particlediameter of crystals is small between the metal film contacting themetal powder 42, i.e., the metal film precipitating earlier, and themetal film contacting the resin material 41, this corresponds to thefact that the metal film has been able to be formed on the resinmaterial 41 in a comparatively early stage and that the metal film witha comparatively small particle diameter has been able to be formed onthe resin material 41.

The adhesion between the metal film and the resin material 41 differentin material is significantly affected by the anchor effect due tocontact between the metal film and the resin material 41 alongunevenness. Since the metal film has a small particle diameter, evenwhen the resin material 41 has slight unevenness, the metal film can beformed along the unevenness. Therefore, the metal film easily producesthe anchor effect between the metal film and the resin material 41 sothat the adhesion between the resin material 41 and the metal film canbe improved. Thus, the adhesion on the resin material 41 can be ensuredto improve the adhesion of the entire metal film to the composite body40. Particularly, this effect is prominently produced when the particlediameter of the metal powder 42 becomes smaller, i.e., when the surfaceroughness of the principal surface 45 of the composite body 40 isreduced, or a proportion of the resin material 41 is increased due toshedding of particles of the metal powder 42 from the principal surface45.

For a method of reducing a difference in average particle diameter ofcrystals of the metal film between on the metal powder 42 and on theresin material 41, the metal film may be formed by using electrolessplating. Particularly, as compared to electrolytic plating, theelectroless plating can make the timings of precipitations of the metalfilm closer between on the metal powder 42 and on the resin material 41so as to make the difference in the average particle diameter smaller.Specifically, although barrel plating is generally employed for smallmass-produced products such as the electronic component 1 from theviewpoint of manufacturing efficiency when electrolytic plating isperformed, this leads to large variations in precipitation timing inportions of the metal film formed on the resin material 41 becausetiming of energization varies for each particle of the metal powder 42.In contrast, in the electroless plating, the metal film startsprecipitating on the metal powder 42 coming into contact with a platingsolution and, since the particles of the metal powder 42 come intocontact with the plating solution at relatively uniform timings, theprecipitation timings can be made relatively uniform over the portionsof the formed metal film. Since the electroless plating makes theprecipitation timings closer to each other in the portions of the metalfilms in this way, the difference in average particle diameter ofcrystals of the metal film can be made smaller between on the metalpowder 42 and the resin material 41. When the particle diameter of themetal powder 42 becomes small and a proportion of the resin material 41increases on the principal surface 45, variations in the precipitationtiming of the electrolytic plating become larger and, therefore, adifference from the electroless plating becomes prominent in such acase.

In the case of a film formed by sputtering or vapor deposition, since adifference itself in average particle diameter of crystals due toformation timing is considered to be small as compared to plating, it isconsidered to be difficult to produce the same effect. As compared tosputtering or vapor deposition, a metal film formed by using plating hashigh adhesion to the metal powder 42 and, therefore, the plating ispreferably used from the viewpoint of the adhesion of the entire metalfilm to the composite body 40. Also from the viewpoints of equipment,processes, a formation time, high manufacturing efficiency such as thenumber of treatments, and low electric resistivity of the metal film,the plating is preferably used as compared to sputtering or vapordeposition. Although a technique exists that uses a resin electrode filmcontaining metal powder in a resin material instead of the metal film,the resin electrode film must have the film thickness of the resinelectrode film increased to some extent so as to ensure adhesion to thecomposite body and the film strength and conductivity of the resinelectrode film itself. However, limitations are often placed on thethickness of the external electrodes 51, 52 of the electronic component1 from the viewpoints of low profile and miniaturization. As a result,sufficient adhesion, film strength, and conductivity may not be ensuredby the resin electrode film. In contrast, as compared to the resinelectrode film, the electronic component 1 has smaller decreasing ratesof the adhesion to the composite body 40 and the film strength andconductivity of the metal film itself even when the film thickness isreduced. Therefore, as compared to the resin electrode film, theelectronic component 1 can include the metal film excellent in adhesion,film strength, and conductivity while achieving a lower profile.

A ratio of average particle diameters in this application is obtained bycalculating an average particle diameter of crystals (particleaggregates) of a metal film from an FIB-SIM image of a cross section ofthe metal film. The FIB-SIM image is a cross-sectional image observed byusing an FIB (Focused Ion Beam) with an SIM (Scanning Ion Microscope). Amethod of calculating an average particle diameter may be a methodincluding obtaining a particle size distribution from image analysis ofthe FIB-SIM image and determining a particle diameter at the integratedvalue of 50% (D50, median diameter) as the average particle diameter.However, since a ratio (relative value) rather than an absolute value ofthe average particle diameter is important, if the image analysis isdifficult, a method may be used that includes measuring a plurality ofmaximum diameters of crystals of the metal film as particle diameters inthe FIB-SIM image and obtaining an arithmetic mean value thereof as theaverage particle diameter.

In the calculation, the number of particles of metal powder to bemeasured in terms of particle diameter may be about 20 to 50. The“crystals of the metal film contacting the resin material 41” and the“crystals of the metal film contacting the metal powder 42” covered bythe calculation are not strictly limited to the crystals directlycontacting the resin material 41 or the metal powder 42 and includecrystals present within a range of about 1 μm from the interface betweenthe metal film and the resin material 41 or the interface between themetal film and the metal powder 42 in the film thickness direction ofthe metal film. Although a relation of the ratio of the average particlediameter is preferably established in the entire metal film, the effectis produced even when the relation is established in a portion of themetal film. Therefore, the average particle diameter may be calculatedfrom an FIB-SIM image of a portion of the metal film or may becalculated from an FIB-SIM image within a range of about 5 μm in thedirection along the principal surface 45, for example.

The electroless plating can reduce the unevenness in film thickness ofthe metal film because of the precipitation timing described above. Incontrast, the electrolytic plating makes the film thickness of the metalfilm on the resin material smaller than the film thickness of the metalfilm on the metal powder.

Preferably, the principal surface 45 of the composite body 40 hasrecesses in a portion thereof, and the inside of the recesses are filledwith the metal film. FIG. 3 is a cross-sectional image (FIB-SIM image)of an interface between the metal film (second external electrode 52)formed by using the electroless plating and the composite body 40,corresponding to FIG. 2. It is noted that an interface between the firstexternal electrode 51 and the composite body 40 is represented by thesame image. As shown in FIG. 3, the principal surface 45 of thecomposite body 40 may have in a portion thereof recesses 45 a formed byshedding of particles of the metal powder 42 during grinding, forexample. In this case, if the recesses 45 a are filled with the metalfilm as shown in FIG. 3, the anchor effect between the metal film andthe resin material 41 is further enhanced so that the adhesion betweenthe metal film and the composite body 40 can further be improved. Therecesses 45 a may be formed by shedding portions of particles of themetal powder 42 as shown in FIG. 3 or may be formed by shedding wholeparticles of the entire metal powder 42. The metal film may completelyfill the recesses 45 a as shown in FIG. 3 or may partially fill therecesses 45 a.

Preferably, a portion of the film thickness of the metal film on themetal powder 42 is equal to or less than the film thickness of the metalfilm on the resin material 41. As a result, the unevenness in theelectronic component 1 can be reduced. Particularly when the metal filmserves as the external electrodes 51, 52, the mounting stability and thereliability are improved. If the metal film serves as internalelectrodes, the stability at the time of lamination is improved.

The metal film is in contact with the internal electrodes 26 a, 26 b. Asa result, the metal film and the internal electrodes 26 a, 26 b aresterically disposed. In this case, as shown in FIG. 1, the metal film isdisposed on a layer different from the internal members (e.g., the firstand second coil conductors 21, 22) of the electronic component 1 incontact through the internal electrodes 26 a, 26 b. As a result,internal members can be disposed in the electronic component 1 withoutbeing affected by the disposition area of the metal film. For example,the electronic component 1 allows the internal electrodes 26 a, 26 b tobe reduced in a planar direction parallel to the principal surface 45 toaccordingly increase the proportion of the composite body 40, so thatthe inductance value can be improved. Alternatively, the electroniccomponent 1 allows the internal electrodes 26 a, 26 b to be reduced inwidth in the planar direction in the same way to make the external sizeaccordingly smaller, so that the mounting area can be reduced. On theother hand, for example, if the external electrodes 51, 52 and theinternal electrodes 26 a, 26 b are integrated as in the case of columnarexternal electrodes embedded in the composite body 40, the internalelectrodes 26 a, 26 b reduced in width as described above may lead tosmaller areas of the external electrodes 51, 52 exposed from thecomposite body 40, resulting in a reduction in the mounting stability.

Preferably, the metal film and the internal electrodes 26 a, 26 b aremade of the same material. As a result, the adhesion between the metalfilm and the internal electrodes 26 a, 26 b is improved.

The metal powder 42 is exposed from the resin material 41 at theprincipal surface 45, and the metal film is disposed on the principalsurface 45. As a result, when the metal film is formed on the principalsurface 45 as described above, the exposed metal powder 42 can be usedand the manufacturing efficiency is improved.

A shape of the metal powder 42 exposed from the resin material 41includes a shape acquired by cutting a portion of an ellipsoid. Theellipsoid includes a spherical shape. A portion of the metal powder 42may be cut during grinding of the principal surface 45, for example. Inthis case, since a cut surface of the metal powder 42 is parallel to theprincipal surface 45 as shown in FIG. 2 and the metal film can beprecipitated along this flat surface, the metal film formed on thismetal powder 42 can be improved in the adhesion to the composite body40.

The principal surface 45 has a portion without the metal film disposedthereon, a resin film 60 is disposed on the portion, and the resin film60 covers the metal powder 42 exposed from the resin material 41. Forexample, the resin film 60 is made of a highly electrically insulatingresin material such as an acrylic resin, an epoxy resin, and polyimide.As a result, since the resin film 60 covers the metal powder 42 exposedfrom the resin material 41, the exposure of the metal powder 42 to theoutside can be prevented. The thickness of the resin film 60 is, forexample, 1 μm or more and 10 μm or less, and is preferably smaller thanthe thickness of the first and second external electrodes 51, 52 inconsideration of the mounting stability.

The metal film is partially disposed on the resin film 60. As a result,as described later, the resin film 60 can be substituted for a mask atthe time of pattern formation of the metal film, and the manufacturingefficiency of the metal film formation is improved.

Preferably, the metal powder 42 is made of metal or alloy containing Fe,and the metal film is made of metal or alloy containing Cu. As a result,the metal film can be formed by the electroless plating without using acatalyst. Since the metal powder 42 is made of metal or alloy containingFe, the magnetic permeability of the composite body 40 can be improvedand, since the metal film is made of metal or alloy containing Cu, theconductivity of the first and second external electrodes 51, 52 can beimproved.

Preferably, the film thickness of the metal film on the metal powder 42is 60% or more and 160% or less of the film thickness of the metal filmon the resin material 41. As a result, the film thickness of the metalfilm becomes uniform. Therefore, the unevenness in the electroniccomponent can be reduced. Particularly, when the metal film serves asthe external electrodes 51, 52, the mounting stability and thereliability are improved. The film thickness may be calculated from theimage analysis, or may directly be measured, in the FIB-SIM image ofFIG. 3, for example. Although the relation of the ratio of the filmthickness is preferably established in the entire metal film, the effectis produced even when the relation is established in a portion of themetal film. Therefore, the film thickness may be calculated from anFIB-SIM image of a portion of the metal film or may be calculated froman FIB-SIM image within a range of about 5 μm in the direction along theprincipal surface 45, for example, or the film thicknesses measured atseveral positions (e.g., five positions) each on the resin material 41and the metal powder 42 may be compared. In comparison of the filmthicknesses, preferably, the comparison is made between the averagevalues of the respective film thicknesses on the resin material 41 andthe metal powder 42.

Pd does not exist in the interface between the metal powder 42 and themetal film as well as the interface between the resin material 41 andthe metal film. As a result, the metal film is formed without applying acatalyst, and the manufacturing efficiency of the metal film formationis improved. In contrast, if a glass epoxy board is plated, a catalystmust be applied to the entire surface of the board, which increases thenumber of processes.

While Pd does not exist in the interface between the resin material 41and the metal film, Pd may exist in the interface between the metalpowder 42 and the metal film. In this case, the metal film can be formedby electroless plating by using the catalyst Pd. In particular, even ifthe metal film is baser than the metal powder 42, for example, if themetal powder 42 is made of metal or alloy containing Cu and the metalfilm is made of metal or alloy containing Ni, a displacement Pd catalysttreatment can be performed to form the metal film by using theelectroless plating. Therefore, a degree of freedom is improved in termsof material selection for the metal powder 42 and the metal film.

As shown in FIG. 3, a portion of the metal film formed by using theelectroless plating goes around along the outer surface of the metalpowder 42 to the inner side of the composite body 40. Specifically, asindicated by a light-colored portion extending along the outer surfaceof the metal powder 42 of FIG. 3, the metal film acting as the externalelectrode 52 has penetrated along the outer surface of the metal powder42 into a gap between the resin material 41 and the metal powder 42. Inthis way, the metal film has precipitated not only on an exposed surface42 a exposed from the resin material 41 of the metal powder 42 but alsoon the contained surface 42 b contained in the resin material 41 of themetal powder 42. Therefore, since a portion of the metal film goesaround along the outer surface of the metal powder 42 to the inner sideof the composite body 40, an increase in area of contact with the metalpowder 42 improves the bonding force with the metal powder 42, and thecontact with the composite body 40 along the shape of the gap betweenthe resin material 41 and the metal powder 42 improves the anchor effectwith the composite body 40. It is considered that the structuredescribed above is formed by infiltration of an electroless platingsolution between the resin material 41 and the metal powder 42.

As shown in FIG. 3, a crystal particle diameter of the metal film formedby using the electroless plating is made larger from the side contactingwith the composite body 40 toward the opposite side thereof (in thedirection of an arrow D). In particular, the average particle diameterof crystals of the metal film formed by using the electroless platingbecomes larger in a region of later precipitation than a region ofearlier precipitation. In this case, the crystal particle diameter ofthe metal film on the side contacting with the composite body 40 (aportion E of FIG. 3) is relatively smaller than the crystal particlediameter of the metal film on the side away from the composite body 40(a portion F of FIG. 3). As a result, the metal film easily produces theanchor effect with the resin material 41, so that the adhesion betweenthe metal film and the composite body 40 can be improved.

A method of manufacturing the electronic component 1 will be describedwith reference to FIGS. 1 and 2.

First, a portion of the composite body 40 made of a composite materialof the resin material 41 and the metal powder 42 is ground to expose themetal powder 42 from a ground surface (the principal surface 45) of thecomposite body 40 (hereinafter referred to as a grinding step).

Subsequently, the metal film (the external electrode 51, 52) is formedon the ground surface of the composite body 40 by using the electrolessplating (hereinafter referred to as a metal film formation step).Specifically, when the metal powder 42 is made of metal or alloycontaining Fe and the metal film is made of metal or alloy containingCu, immersion of the composite body 40 into an electroless platingsolution causes precipitation of Cu displacing Fe, and the platingsubsequently grows due to the effect of a reducing agent contained inthe electroless plating solution.

As a result, the adhesion between the metal film and the composite body40 and the film strength and conductivity of the metal film itself canbe improved as described above. Additionally, a desired thickness can beacquired with reduced variations, and the metal film can be formed by asimple method with a high manufacturing efficiency.

At the metal film formation step, the metal film is formed on the resinmaterial 41 and the metal powder 42 by using the electroless plating. Asa result, the adhesion between the metal film and the resin material 41can be ensured as described above.

At the metal film formation step, the metal film is formed by using adisplacement precipitation reaction to precipitate the metal film on themetal powder 42 exposed from the ground surface and by growing theprecipitated metal film by using the electroless plating. As a result,the metal film can be formed in a simple process. At the metal filmformation step, the electroless plating is performed without applying acatalyst. As a result, the metal film can be formed in a simple process.

After the grinding step, the resin film 60 is formed on a region of aportion of the ground surface of the composite body 40 (referred to as aresin film formation step), and the resin film 60 is used as a mask toform the metal film at the metal film formation step. As a result, thepattern formation can be achieved without etching the metal film and,for example, even as compared to the subtractive method and thesemi-additive method, the manufacturing efficiency is improved. In thiscase, the metal film is partially disposed on the resin film 60.

Steps before the grinding step may be commonly performed steps andinclude, for example, a step of forming the first and second coilconductors 21, 22 and the electrodes 25 a to 25 d on the upper and lowersurfaces of the board 10 having a hole at the center, a step of coveringthe board 10 and the first and second coil conductors 21, 22 with theinsulator 30, and a step of covering the insulator 30 with the compositebody 40. The internal electrodes 26 a, 26 b are acquired by fillingholes disposed in the insulator 30 and the composite body 40 with aconductivity paste.

The present disclosure is not limited to the embodiments described aboveand may vary in design without departing from the spirit of the presentdisclosure.

Although the metal film is used as the external electrodes in theembodiments, the metal film may be used as the internal electrodes,routing wirings, etc. In particular, the composite body 40 may besubstituted for the board, and the first and second coil conductors 21,22 may be formed on the composite body 40 as the metal film by using theelectroless plating. As a result, the metal film having the effectsdescribed above can be acquired as the first and second coil conductors21, 22, and the metal film can be formed as is the case with the effectsdescribed above. In this case, the film thickness of the metal film canbe 40 μm or more and 120 μm or less, for example.

Although the resin film is left as a mask in the embodiments, the resinfilm may eventually be exfoliated.

Although the electronic component is a coil component in theembodiments, the electronic component may be a passive component such asa capacitor, an LC composite component, a thermistor, and apiezoelectric sensor. In this case, the particles may be electricconductors.

The coil component defined as the electronic component is not limited toa component according to a thin-film construction method and may be acomponent according to a lamination construction method.

The particles contained in the composite body may have any particulateshape and have no limitation on particle diameter. As the particlediameter becomes smaller, the effect of the present disclosure has arelatively larger impact; however, even when the particle diameter islarge, the adhesion between the resin material and the metal film can beimproved so as to improve the overall adhesion of the metal film.

1. A method of manufacturing an electronic component comprising: agrinding step of grinding a portion of a composite body made of acomposite material of a resin material and a metal powder to expose themetal powder from a ground surface of the composite body; and a metalfilm formation step of forming a metal film on the ground surface of thecomposite body by using electroless plating.
 2. The method ofmanufacturing an electronic component according to claim 1, wherein atthe metal film formation step, the metal film is formed on the resinmaterial and the metal powder by using the electroless plating.
 3. Themethod of manufacturing an electronic component according to claim 1,wherein at the metal film formation step, the metal film is formed byusing a displacement precipitation reaction to precipitate the metalfilm on the metal powder exposed from the ground surface and by growingthe precipitated metal film by using the electroless plating.
 4. Themethod of manufacturing an electronic component according to claim 1,wherein at the metal film formation step, the electroless plating isperformed without applying a catalyst.
 5. The method of manufacturing anelectronic component according to claim 1, wherein the metal powder ismade of metal or alloy containing Fe, and wherein the metal film is madeof metal or alloy containing Cu.
 6. The method of manufacturing anelectronic component according to claim 1, further comprising a resinfilm formation step of forming a resin film on a region of a portion ofthe ground surface of the composite body after the grinding step,wherein the resin film is used as a mask to form the metal film at metalfilm formation step.